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UID:r_9a7dea362aaf7df5-due@rfpfinder.net
DTSTAMP:20261012T115405Z
DTSTART:20260212T000000Z
DTEND:20260212T010000Z
SUMMARY:Due: TECHNOLOGY LICENSING OPPORTUNITY: Electroplated Materials and Array Design for Scintillators
DESCRIPTION:TECHNOLOGY LICENSING OPPORTUNITY: Electroplated Materials and Array Design for Scintillators\nENERGY\, DEPARTMENT OF\nSolicitation S-133996\nhttps://rfpfinder.net/rfp/technology-licensing-opportunity-electroplated-materials-and-array-des-9a7dea36/
URL:https://rfpfinder.net/rfp/technology-licensing-opportunity-electroplated-materials-and-array-des-9a7dea36/
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ACTION:DISPLAY
DESCRIPTION:Due: TECHNOLOGY LICENSING OPPORTUNITY: Electroplated Materials and Array Design for Scintillators
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